Conference Overview
Image sensors and systems are ubiquitous in various professional applications like mobile phones, automotive, space, medical, scientific, and industrial uses. Their benefits include low power consumption, minimal noise, high resolution, accurate geometry, wide spectral sensitivity, and exceptionally high quantum efficiency. These advantages have enabled groundbreaking applications.
Located in the Silicon Valley area, the conference showcases contributions from both industry and academia, featuring presentations from distinguished keynote speakers. The conference aims to foster networking and collaboration among peers in the global imaging community, and facilitate the dissemination of new research.
Attendees can engage in overview talks, panel discussions, and Q&A sessions with experts from industry and academia.
2025 Conference Topics
Image input
- Novel image sensors
- Optics and module
- Depth sensing
Image processing
- Device calibration
- Image/video artifact corrections
- Enhancement
- Rendering
- Computational photography
- Image fusion
- Sensor fusion
- Photogrammetry
- Depth map estimation and 3D imaging
Imaging system architecture
- Novel system design and simulation
- Imaging system pipeline
- 3A
- Digital image stabilization
- Image quality and usage experience
Immersive imaging
- 360 surround camera architectures
- Cinematic VR systems
- Digital sense
- Applications
- Challenges and innovative solutions
Deep learning
- Application of machine learning/deep learning approaches toward solving problems related to mobile capture, AR/VR, and general camera image pipelines
Advances in technologies and models
- Innovative devices
- Innovative process and post-process (e.g., 3D integration)
- Advances in alternative technologies (organic, a-Si, etc.)
- Noise analysis and noise reduction
- Advanced/novel image sensor or pixel control circuits
- Advanced/novel defects and noise reduction algorithms
- Color pattern or pixel architectures and color demosaicing and reconstruction techniques
- ADCs
High-end image sensors
- High speed
- Large format
- Ultra-low power
- Ultra-low noise
- Very high dynamic range
On-chip processing for smarter sensors
- On chip signal or image processing
- Image sensors for 3D imaging
- Bio-inspired image sensor
Challenges associated with event acquisition via:
- 360 and 3D cameras
- Multi-camera networks
- Intelligent robotic cameras
- Fixed point cameras
- Drones (unmanned aerial vehicles)
Image sensors assessment and novel implementations or applications
- Hyperspectral image sensors or camera
- Image sensors for computational imaging
- Image sensors for automotive applications
- Image sensors used in integrated networks (internet of things)
- Image sensors for drones and autonomous vehicles
- Sensor fusion
- Miniature autonomous systems based on image sensors
- Image sensors and imaging systems for medical applications
- Imaging beyond the visible (UV, NIR, SWIR, X-Ray)
2025 Special Sessions
TBA
Awards
Arnaud Darmont Memorial Best Paper Award
Past winners
| 2024 |
Arnaud Darmont Memorial Best Paper
Bruno Henrique Lopes, Pascal Fontenau, Boris Rodrigues Goncalves, Matteo Vignetti, and Gabriel Mugny, STMicroelectronics, and Maryline Bawedin and Anne Kaminski, University of Grenoble Alpes,(France) for their work on Simulation of Indirect Time of Flight Pixel Using High-frequency Operation Low-voltage Trench Gates |
2023 |
Arnaud Darmont Memorial Best Paper
Ruben Gomez-Merchan, Juan Antonio Leñero-Bardallo, and Ángel Rodríguez-Vázquez, University of Seville-IMSE CNM (CSIC) (Spain) for their work on Simu "A self-powered asynchronous image sensor with independent in-pixel harvesting and sensing operations." |
| 2022 |
Arnaud Darmont Memorial Best Paper
Masahide Goto, Yuki Honda, Masakazu Nanba, Yoshinori Iguchi, Takuya Saraya, Masaharu Kobayashi, Eiji Higurashi, Hiroshi Toshiyoshi, and Toshiro Hiramoto (NHK Science & Technology Research Laboratories, The University of Tokyo, and National Institute of Advanced Industrial Science and Technology (Japan)) for their work on "3-Layer stacked pixel-parallel CMOS image sensors using hybrid bonding of SOI wafers." |
| 2021 |
Arnaud Darmont Memorial Best Paper
Seung-Wook Lee, Seungwon Cha, Dongyoung Jang, Mihye Kim, Haewon Lee, Nakyung Lee, Seonok Kim, Kwanyoung Oh, Daehyung Lee, SeungHan Hong, Hana Lee, Sunghoon Oh, Donghyuk Park, Yitae Kim and JungChak Ahn (Samsung Electronics DS) for their work on "A low-voltage 0.7 μm pixel with 6000 e- full-well capacity for a low-power CMOS image sensor." |
| 2020 |
Arnaud Darmont Memorial Best Paper
Yasuyuki Fujihara, Maasa Murata, Shota Nakayama, Rihito Kuroda, and Shigetoshi Sugawa (Tohoku University) for their work on "An over 120dB dynamic range linear response single exposure CMOS image sensor with two-stage lateral overflow integration trench capacitors." |
| 2019 |
Arnaud Darmont Memorial Best Paper
Arnaud Peizerat and G. Renaud (CEA-LETI) for their work titled "Correlated multiple sampling impact analysis on 1/f noise for image sensors." |
| 2018 |
Best Paper
Fei Wang and Albert Theuwissen (Technische University of Delft and Harvest Imaging) for their work on "Two calibration methods to improve the linearity of a CMOS image sensor." |
| 2018 |
Best Paper
Dietmar Wueller, Uwe Artmann, Vijay Rao, Guenter Reif, Joerg Kramer,and Fabian Knauf (Image Engineering GmbH & Co. KG and Vodafone Group Services GmbH) for their work titled "VCX: An industry initiative to create an objective camera module evaluation for mobile devices." |
| 2017 |
Best Paper
Laurent Alacoque, Sébastien Martin, Wilfried Rabaud, Édith Beigné, and Antoine Dupret (Université Grenoble Alpes and CEA) for their work on "A 128x128, 34um pitch, 8.9mW, 190mK NEDT, TECless Uncooled IR Bolometer image sensor with column-wise processing." |
| 2017 |
Best Paper
Noha El-Yamany (Intel Corporation) for his work on "Robust defect pixel detection and correction for Bayer imaging systems." |
| 2016 |
Best Paper
Grigorios Tsagkatakis, Murali Jayapala, Bert Geelen, and Panagiotis Tsakalides (FORTH, IMEC, and University of Crete) for their work titled "Non-negative matrix completion for the enhancement of snapshot mosaic multispectral imagery." |
| 2016 |
Best Paper
Subash M. Sridhar, Henry G. Dietz, and Paul S. Eberhart (University of Kentucky) for their work on "Use of flawed and ideal image pairs to drive filter creation by genetic programming." |
| 2016 |
Best Student Paper
Xiaoliang Ge (Technische Universiteit Delft) for her work titled "A comparative noise analysis and measurement for n-type and p-type pixels with CMS technique." |
| 2016 |
Best Student Paper
Yang Yang (University of Delaware) for his work on "Virtual DSLR: High quality dynamic depth-of-field synthesis on mobile platforms." |
2025 Committee
Conference Chairs
Francisco Imai, Apple Inc. (US)
Jon S. McElvain, Dolby Labs, Inc. (US)
Nitin Sampat, Edmund Optics (US)
Hari Tagat, Samsung Semiconductor (US)
Program Committee
Nick Bulitka, VIAVI Solutions (Canada)
Peter Catrysse, Stanford University (US)
Calvin Chao, Taiwan Semiconductor Manufacturing Company (TSMC) (Taiwan)
Tobi Delbrück, Institute of Neuroinformatics, University of Zurich and ETH Zurich (Switzerland)
Henry Dietz, University of Kentucky (US)
Joyce E. Farrell, Stanford University (UUS)
Boyd Fowler, OminVision Technologies (US)
Eiichi Funatsu, OmniVision Technologies, Inc. (US)
Sergio Goma, Qualcomm Technologies Inc. (US)
Rihito Kuroda, Tohoku University (Japan)
Kevin Matherson, Microsoft Corporation (US)
Arnaud Peizerat, Commissariat à l’Énergie Atomique (France)
Hans Reyserhove, Ceremorphic (US)
Jackson Roland, Apple Inc. (US)
Min-Woong Seo, Samsung Electronics, Semiconductor R&D Center (Republic of Korea)
Gilles Sicard, Commissariat à l'Énergie Atomique (France)
Radka Tezaur, Intel Corporation (US)
Jean-Michel Tualle, Université Paris 13 (France)
Dietmar Wueller, Image Engineering GmbH & Co. KG (Germany)